Ceramic Leadless Chip Carrier Socket

Well suited for devices with low wire bond pin count configurations clcc packages have proven to be a viable solution for a variety of applications.

Ceramic leadless chip carrier socket.

Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications. Polarizing post on bottom of socket. 28 44 52 68 84 and 124. Clcc or lcc ceramic leadless chip carrier.

Surface mount and soldertail options are available. Key benefits for andon electronics patented lcc sockets. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact force with the socket. Typical surface mount.

For electrical connection to the outside world the lcc instead uses flat metal contacts or metallized castellations known as pads around the four sides of the package bottom. Avoid cleaning solutions clouding glass cover. Just a short video to show how i hand solder a ceramic leadless chip carrier clcc package to a circuit board in this case a si570. Das basismaterial kann plastik oder keramik sein und die anschlusskontakte können unmittelbar an den package seiten ausgeführt sein oder auch als pins leadless chip carrier lcc ist ein chip carrier package ohne anschlusspins.

The chip is held into the socket by friction. Heat sinks also available in six sizes. Adaptor i o cable exit. High temperature pps plastic and becu contacts for.

Leadless chip carrier lcc kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc. Avoid color array high temperature soldering damage. Variety of lid options available only for 68 position. Heat sink available for 68 position.

Die anschlüsse befinden sich als kontakte an den vier außenseiten des packages. Generally speaking sockets for plcc chips j lead are not compatible with leadless chip carriers since their contacts are typically recessed between fingers that align and grip the plcc package itself. No tools required for package insertion removal. Leadless chip carrier sockets conform to jedec standards a b c and d.

U lid for i c e. Avoid electrostatic discharge esd production line problems. The ceramic leadless chip carrier or clcc or lcc is a square or rectangular surface mount ceramic package that has no leads. Clcc packages ceramic leadless chip carriers provide a lower cost surface mount technology smt compatible ic package solution.