Ceramic Wafer Chuck

Photomachining offers a variety of porous vacuum chuck designs for use with thin films semiconductor wafers and other flat samples.

Ceramic wafer chuck.

The wafer chuck ensures accurate positioning of the wafer in various process steps. Mechatronic chucks are designed for secure placement of various wafer types e g. Our wafer chuck tables electrostatic chucks and heaters are virtually found in many semiconductor equipment in most of the process from front to end from universities international researching institutes and independent labs to all major world class fabs and manufacturing sites our wafer handling solutions are synchronizing with the rapid development of semiconductor industry and continue. The plate shown in figure 7 is a ni plated aluminum base with vacuum access holes and a porous ceramic wafer surface which has been ground flat to within 8um in flatness and parallelism across the 12 inch.

By using a special porous ceramic the wafer is held on its backside without contacting the wafer chipside. Vacuum wafer chucks are used in the semiconductor industry to accurately position the wafer in the machine. Chucks für wafer bis zu 450 mm 18 inch chucks für masken reticle. Intermediate via layers connect the pattern to a back side metal layer at the bottom of the chuck to which power leads can be connected.

Mikro struktur noppen strukturen reduzieren die kontaktfläche des wafers zum chuck um den faktor 100 1 kontaktfläche kein sticking zwischen wafer und chuck. Standard ultra thin warped ewlb wafer mit support ring film frame mems. Porous ceramic wafer chucks are an arc specialty. New and refurbished porous ceramic chucks for disco adt k s applied materials.

The chuck has a pore size of less than 25 microns 60 microns optional assuring uniform suction and strong holding power for even the smallest parts. With our unique know how of ceramic industry and years immersing in semi conductor industry werlchem llc is at the forefront in the development of materials and components for the demanding environments of semiconductor processing such as chuck table wafer carriers cmp grinding and polishing chucks end effectors etc. The vacuum holding force is evenly spread on the entire backside surface to flatten the wafer. By using ceramic materials flatnesses of less than 1 micron can be achieved.

The plate shown in fig. Porous ceramic vacuum chuck.