Ceramic Small Outline Packages

Standard ceramic packages are useful in customer device evaluations and low volume orders enabling customers to reduce tooling costs and design time.

Ceramic small outline packages.

Package style descriptive code clson ceramic low profile small outline. No leads package body material type c ceramic mounting method type s surface mount issue date 19 12 2018 manufacturer package code 98asa01007d table 1. Chelsea technology ceramic small outline packages feature. Leadless chip carriers lcc microwave packages.

Connected pad number unit. Hybrid packages ceramic and metal. Cerdip dual inline packages. Copper cu a copper alloy a copper nickel tin alloy is used as the lead frame material in plastic packages.

Power transistor outline to packages. Csop ceramic small outline packages mm inch unit. Small outline package straight lead small outline l leaded package 1 27. Ceramic small outline package csop national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.

Package summary parameter min nom max unit package length 5 mm package width 4 mm package height 1 365 mm. Mm please click here for inch dimensions n no metallization 0 no connection r0169c lead forming lead count lead pitch 1st 2nd 3rd 4th total. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Lead count cavity overall layer t hic kness total 0084 0085 0085 0085 lead nt k mat erial code ring connection drawing no o non co ne ct attach.

Up u down d 1st 2nd 3rd total pitch stand off height seal ring. Also used as a structural material in ceramic. Material in laminated ceramic packages. Ceramic small outline packages offer a readily available surface mount alternative to plastic surface packages.

Mm lead count cavity overall layer thickness lead ntk material code b black w white connection 0 non conect drawing no. A hermetic package with the same footprint as plastic sops. 10 lead plastic micro small outline package ms msop. Ceramic small outline package.