For electrical connection to the outside world the lcc instead uses flat metal contacts or metallized castellations known as pads around the four sides of the package bottom.
Ceramic leadless chip carrier package.
The ceramic leadless chip carrier or clcc or lcc is a square or rectangular surface mount ceramic package that has no leads.
Ceramic leadless chip carrier packages clcc d j x 45o d3 b h x 45o a a1 e l l3 e b3 l1 d2 d1 e1 e2 e1 l2 plane 2 plane 1 e3 b2 0 010 e hs s 0 010 e fs s e 0 007 e fm s hs b1 h f j20 a mil std 1835 cqcc1 n20 c 2 20 pad ceramic leadless chip carrier package symbol inches millimeters min max min max notes.
Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no.
1st 2nd 3rd total seal ring die attach a x b c x d e x.
Ceramic leadless chip carrier lcc is a quad row package similar to a qfn or qfp with no exposed pad.
Lcc leadless ceramic e ey leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below.
Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic.
A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package.
Well suited for devices with low wire bond pin count configurations clcc packages have proven to be a viable solution for a variety of applications.
Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or single die applications.
Clcc packages ceramic leadless chip carriers provide a lower cost surface mount technology smt compatible ic package solution.
27 total package options for the texas instruments leaded chip carrier lcc.