Ceramic Lcc Socket

Clcc or lcc ceramic leadless chip carrier.

Ceramic lcc socket.

Avoid color array high temperature soldering damage. Heat sinks also available in six sizes. Yamaichi test and burn in sockets offers the industry s most comprehensive range of test and burn in sockets. Avoid electrostatic discharge esd production line problems.

Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Can i use a ceramic leadless chip carrier lcc in a plcc socket. Modern lcc image sensors are e g. Lcc image sensors require longer soldering times for rohs high temperature solders.

Leadless chip carrier sockets conform to jedec standards a b c and d. Die anschlüsse befinden sich als kontakte an den vier außenseiten des packages. Lcc leadless chip carrier sockets. New antistatic cpu storage box.

The ceramic leadless chip carrier or clcc or lcc is a square or rectangular surface mount ceramic package that has no leads. Rare amd duron cpu dhg1000avs1b. Packaged with up to 100 castellations contacts. From different supplier datasheets i unfortunately get conflicting information about the compatibility of different chips and sockets.

Most suppliers list the jedec mo 47 standard as a compatible chip which has j shaped leads some claim that a leadless chip carrier also works. Developed using yamaichi electronics compression mount technology cmt the cmt series test and burn in sockets meet the challenging design specifications for high power burn in socketing applications. A unique design avoids cracking of solder joints and ceramic substrate of sensitive components. For electrical connection to the outside world the lcc instead uses flat metal contacts or metallized castellations known as pads around the four sides of the package bottom.

A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. New ti486dx2 g66 wr cpu rare. 28 44 52 68 84 and 124. The ceramic substrate expands while the solder joint is fixed and cracks.

Key benefits for andon electronics patented lcc sockets. Surface mount and soldertail options are available.