Ceramic Ic Packages

Ceramic protects the ic from higher temperature and humidity conditions.

Ceramic ic packages.

In ic packages it certainly is desirable to dissipate heat with the lowest possible thermal resistance. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Ceramic substrates for probe cards. Package forms packages come in many forms including dip dual inline sip single inline and pga pin grid array pin insertion types and surface mount types including j lead flat lead gull wing leadless bga ball grid array lga land grid array csp chip size package and other types.

A wide variety of ic package types use ceramic materials. For a table of ceramic material properties click here. Tcp and cob packages are custom designs conforming to the customer s specifications. We also accept inquiries regarding the following features of ic packages.

For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs. A very large number of different types of package exist. Click the cerdip for a larger view. Standard packages and lids for device evaluation.

However at the same time electrical insulation and protection from oxidation corrosion are also desirable at least for discrete components that are likely to be handled or exposed to the environment. The graphic above shows a through hole device in a ceramic package. A ceramic dip is also called a cerdip. Ceramic packages for large scale integration lsi devices.

Package materials can be selected. 6 pin 8 pin 14 pin and 22 pin sockets. Classification by package materials packages are broadly classified into ceramic and plastic packages. Ceramic ic packages are the package that mainly use ceramic materials.

Some package types have standardized dimensions and tolerances and are registered with trade industry associations such as jedec and pro electron. One of the main properties of ceramic ic packages is that they can be sealed hermetically and even with large number of electrical connections they can be manufactured in small sizes. We will procure the packages from industry leading ceramic suppliers and assemble your devices to your specifications. Industrial equipment and communications equipment mpu asic and high frequency devices and device evaluations.

Ic package ceramics. Is a world wide authorized distributor of packages and lids for ic assembly. Material properties process flow. Ceramic ic packages for prototype devices when ceramic packages are the right vehicle for your prototype devices quik pak can provide a full turnkey solution.

Please contact us if you have questions. The picture below shows different plastic dip sockets. After the ic chip is mounted it is sealed airtight with a metal or ceramic lid.